Workshops and Special Events


    Workshop: Next Generation Integrated Photonics for Optical I/O

Today’s enhanced data processing and communication needs continue to fuel an insatiable drive towards ever increasing computing power. As we approach the inevitable end of Moore’s Law after almost half a century, computing architectures will need to change dramatically in order for innovation to continue. Integrated optical I/O building blocks will lead the way into this new era by bringing about the fusion of computing and optical technology.

This workshop intends to gather experts in the field to establish an overview of the current state of integrated optical I/O research with a focus on:
• Integrated photonic components for optical I/O
• Advances in Optical I/O design, modeling and analysis of novel propagation effects
• An industry perspective on integrated optical I/O

The workshop further aims at stipulating an open discussion between panelists and attendees on the challenges and opportunities envisaged in the deployment of massive integrated optical I/O for AI and high-speed computing.”



Ting Wang, Institute of Physics, CAS

Siming Chen, Institute of Semiconductors, CAS



Yating Wan,  KAUST,Integrated silicon photonics with quantum dot on-chip lasers

Zihao Wang, Institute of Physics, CAS,Comb Laser Source for Integrated Optical I/O

Chao Xiang,  The University of Hong Kong, TBD

Ke Li,  Pengcheng Laboratory, TBD

Xin Yin,  Ghent University, High-speed transceivers for optical interconnects

WeiWei Zhang, University of Southampton, Miniaturized silicon modulators for high-performance Photonic Integration

Haisheng Rong, Intel, High bandwidth density and energy-efficient optical I/O based on silicon photonics

Di Liang, Alibaba Group, TBD

Kazuhiko Kurata, AIO Core, Development status and future prospects of compact Si photonics transceiver

Jeoy Zhou, Sicoya, TBD


    Workshop: Enabling space division multiplexing technologies

Space division multiplexing (SDM) exploiting spatial diversity to increase transmission capacity has been a hot research topic for photonics society over the past decade. From fiber innovation such as coupled-core fiber to petabit-per-second transmission over a single optical fiber, emerging SDM technologies start to make both academia and industry rethink about device design and system architecture.

In this workshop, we discuss the enabling space division multiplexing technologies of fibers, amplification, devices, transmission and system.



Juhao Li, Peking University

Haoshuo Chen, Nokia Bell Labs

Takashi Sasaki, Sumitomo



Tetsuya Hayashi, Sumitomo, Multicore fibers for SDM transmissions

Takanori Inoue, NEC, SDM Technology for Submarine Cable Systems

Shen Lei, YOFC, Weakly-coupled few-mode fiber

Chenhui Li, Zhejiang University, High density optical transceivers

Takuya Oda, Fujikura, Field deployment of multicore fibers

Li Pei, Beijing Jiaotong University, Multi-layer doped erbium-doped fiber

Jianxiang Wen, Shanghai University, Bandwidth-extended SDM amplification

Yunhe Zhao, Shanghai Maritime University, Long period grating for multimode and multicore fiber

Lipeng Feng, China Telecom fenglp, Field deployment and transmission system of multicore fiber



  Workshop: Miniaturization of optical spectrometers

Optical spectrometer is one of the most powerful and widely used characterization tools in scientific and industrial research. Miniaturization of optical spectrometers has been a major topic in optical spctroscopy research since the last three decades. The aim of the development of micro-spectrometers was to open a range of opportunities for portable or handheld spectral analysis.  Toward this aim, a wide variety of miniaturized spectrometer systems have emerged with reducing cost, complexity, and eventually energy consumption. 

This workshop intends to gather experts in the field to establish an overview of the current state of micro-spectrometers research with a focus on:
• New strategies and configurations for the miniaturization of spectrometers
• Advances in spectrometers design, modeling and algorithms
• An industry perspective on micro-spectrometers

The workshop further aims at stipulating an open discussion between panelists and attendees on the challenges and opportunities envisaged in the deployment of massive parallel transmission systems.



Zongyin Yang,  Zhejiang University



Yidong Huang, Tsing-Hua University, Real-time ulterspectral imaging with high spatial resolution

Jianji Dong, Huazhong University of Science and Technology,Cascaded nanobeam spectrometer with high resolution and scalability

Zongfu Yu, University of WiscUniversity of Wisconsin,Spectral analysis based on compressive sensing in nanophotonic structures

Ang Li,  Nanjing University of Aeronautics and Astronautic, An integrated silicon spectrometer with broad operation temperature range

Weiwei Cai,Shanghai Jiao Tong University, Reconstructive spectrometry based on compressive sensing and tomography

Shaowei Wang, Shanghai Institute of Technical Physics Chinese Academy of Sciences, The development and application prospective of miniatured spectrometer

Bill Choi, NanoLambda, A Spectrum is Worth a Thousand Pictures

Tao Yang, Nanjing University of Posts and Telecommunications, Hyperspectral imaging based on scattering media

Qin Chen, Jinan University, Plasmonics enabled on-chip spectroscopy

Yuanmu Yang, Peking University, Metasurface for multi-dimensional light field sensing

Qifeng li, Tianjin University & Huijie Wang, Nanjing University of Aeronautics and Astronautics, On-chip spatial heterodyne Fourier transform spectrometers by multi-mode detection


    Workshop: Combs in research and applications

Optical frequency combs have revolutionized technology, with applications ranging from fundamental science to industry. Research in comb generation now extends from fiber-based systems to chip-scale platforms using various materials.

The potential of comb-based systems has rapidly progressed, not only in traditional fields like frequency synthesis and optical communications but also in new interdisciplinary areas such as LiDAR, neuromorphic computing, and quantum optics. These advancements open up exciting opportunities for innovation and breakthroughs in a wide range of scientific and industrial domains.
This workshop indends to gather experts in the filed to establish an overview of the current state of comb research and its applications with a focus on:
• Advanced device fabrication techniques and innovative comb generation schemes
• Chip-scale manipulation methods for comb generation
• Co-integration of comb with its pump source, amplifier and backend processing system
The objective of this workshop is to provides a platform for experts to exchange ideas, foster collaborations, and identify future directions in comb research. through which participants will gain insights into the latest advancements, challenges, and opportunities towards the next generation comb technology.



Xingjun Wang, Peking University

Yongzhen Huang, Institute of Semiconductors, CAS



Yasha Yi, University of Michigan, Three-Dimensional multi layer photonic phased arrays for chip-scale intelligent sensing applications

Jian Wang, Huazhong University of Science and Technology, Chip-scale multi-dimensional light field manipulation

Chao Xiang, The University of Hong Kong, Semiconductor laser integration for microcombs

Kan Wu,  Alibaba, Near-zero-dispersion soliton in a fiber F-P microcavity

Baicheng Yao, University of Electronic Science and Technology of China, Brillouin-Kerr soliton microcomb multiplexing

Heng Zhou, University of Electronic Science and Technology of China, Approaching the Quantum Noise Limit of Microcavity Kerr Soliton

Haowen Shu, Peking University, Microbomb driven silicon photonics

Yang Liu, EPFL, Erbium- doped photonic integrated circuits

Zhichao Ye, Qaleido Photonics, Ultralow-loss Silicon Nitride Waveguides for Microcomb Generation



  Workshop: Optical X-haul Networks – IEEE INGR optics

As networks continue to grow in scale and performance, they face increasingly complex challenges and must constantly push the boundaries of technology to evolve. The IEEE International Network Generation Roadmap (INGR), a part of the IEEE Future Networks Initiative, was created to develop a 10-year roadmap for wireless networks. Recently, the INGR has been expanded to include optical networks, including x-haul networks such as fronthaul, mid-haul, and backhaul. X-haul networks are a critical component of the next generation mobile networks, forming the fabric of interconnections between radio units, distributed units, and central units.
As the density of cells and the bandwidth offered by these cells increase, future X-haul networks will face increasingly stringent requirements for delay, bandwidth, energy efficiency, latency, synchronization, and deployment flexibility and scalability. To meet these demands, a variety of transport technologies, including dark fiber, WDM, gray optics, and TDMPON, will be critical.
This workshop will explore the current state, future challenges, and potential solutions of X-haul networks, including optical transceivers, transport, synchronization, PON with CO-DBA/CTI, and other relevant topics.



Reza Vaez-Ghaemi, Viavi solutions

Chathu Ranaweera, Deakin University

HwanSeok Chung, Electronics and Telecommunications Research Institute



HwanSeok Chung, ETRI, Low latency PON with CO-DBA/CTI

Sheng Liu, China Mobile, The trend of WDM technologies for transport and fronthaul

Hirotaka Nakamura, NTT, 100G-BiDi transceiver for high speed X-haul

Huijun Sha, Viavi Solutions, Esting Applications for Xhaul Optical, Transport and Synchronization Networks

Hong Seok Shin, SK Telecom, Mobile Fronthaul Solution in SK Telecom


    Workshop: Light Detection and Ranging (LiDAR)

Light Detection and Ranging, especially autonomous LiDAR is a booming market full of disrupting technologies and rapid developments. From robot cars to robot vacuums, it offers ground-truth environmental data for sensing and classification and is identified as the key component to deliver safer and smarter autonomous vehicles. Building LiDAR systems of a more compact form-factor, at a lower cost and with less human labor while maintaining or improving key performance characteristics has been motivating researchers and developers to innovate and integrate.
This workshop intends to gather experts in the field to establish an overview of the current state of LiDAR research with a focus on:
•    Solid-state beamsteering technologies for LiDAR
•    Advances in ranging schemes including but not limited to ToF, FMCW, RMCW
•    Advances in LiDAR-oriented light sources that support the aforementioned ranging schemes    
•    An industry perspective on LiDAR and LiDAR technologies concerning packaging, scaling, and field stability with respect to automotive-grade specifications.
The workshop further aims at stipulating an open discussion between panelists and attendees on the challenges and opportunities envisaged in the deployment of next generation solid-state LiDARs.



Li Zeng, Huawei

Linjie Zhou, Shanghai Jiao Tong University



Shilong Pan, Nanjing University of Aeronautics and Astronautics, FMCW lidar for autonomous vehicles

Minhua Chen, Tsinghua University, Hybrid integrated narrow linewidth FMCW laser

Jie Sun, Morelite, Recent Progress in Chip-scale FMCW Lidar

Xiaochen Sun, LuminWave, Toward the Commericalization of Si Photonics FMCW LiDAR

Hongyan Fu, Tsinghua Shenzhen lnternational Graduate School, High-speed and Wide-field Spectral-scanning Coherent LiDAR Systems Based on Tunable VCSEL

Hao Hu, DTU, Integrated optical phased array for next-generation solid-state LiDARs

Jiaoqing Pan, ISCAS, Research on silicon based integrated beam scanning chip

Yaochen Shi, Zhejiang University, Optical phased array based on silicon waveguide for wide-angle beam steering

Junfeng Song, Jilin Univeristy, Silicon based Optical phased array and applications in Lidar and Free space optical communications


    Workshop: Electronics-Photonics Integrated Circuits: Design, Fabrication, Co-integration and Applications

This workshop focuses specifically on photonics integrated circuits (PICs) design, fabrication, co-integration and applications. It brings together researchers, engineers, and industry professionals from China and around the world to share their latest findings and to discuss the latest PICs foundry related research, innovations and services, and provides attendees with the opportunity to learn about new techniques and knowledge set for designing and fabricating PICs.




Wenting Wang,Xiongan Institute of Innovation

Liangjun Lu,Shanghai Jiao Tong University



Shuai Chen,Jiansheng Jie's Research Group, The Fabrication Process of Key Materials in Integrated Optics

Ruping Cao, Luceda PhotonicsThe Fabrication Process of Key Materials in Integrated Optics

Can Yao, LIGENTECLow loss silicon nitride photonic integrated circuit applications: From Academy to Industry

 Lin Zhang, Tianjing UniveristyNanofabrication for diversified applications in photonics

Adam Lewis, CUMECSilicon Photonic Foundries - Platforms, PDKs and Progress

Zhihua Li, Institute of Microelectronics, CASMPW and Customization Services of SiPh Platform of IMECAS



  Workshop: New Applications/Emerging Applications 

This workshop is dedicated for a few selected topics on the new/emerging applications of optics and photonics, including sensing, signal processing, and computing, both in the classical and quantum regimes. Such new/emerging applications are enabled by the most recent development of diverse optical and photonic platforms, including integrated devices on a variety of rigid and flexible materials, as well as free-space optics.



Daoxin Dai, Zhejiang Univeristy

Yaocheng Shi, Zhejiang Univeristy



Jianwei Wang, Peking University, Large-scale integrated silicon-photonic quantum circuits

Binfeng Yun, Southeast University, Microwave photonic beamforming chip

Xinxiang Niu, Huawei Technologies Co.Ltd., The improvements for optical diffractive deep neural networks

Zhenzhou Cheng, Tianjing University, Infrared silicon photonic devices for gas sensing
Lan Li, Westlake University, Flexible Photonic Devices and Applications
Huan Li, Zhejiang University, Anisotropic LNOl devices for Polarization Handling and Multiplexing


    Workshop: Short Reach Optical Systems: Applications and Technologies

There has been explosive interest in short-reach optical communications because its diversity in applications and technologies. Many immerging applications such as body area networks, next generation PONs, datacenter networks, and mobile x-hual networks have created challenges in providing increasingly high date rate, improving network’s interoperability, security, flexibility and adapatability with considerably reduced latency, while still greatly constraining the cost, power, and footprint. There presents an unprecedented research and development opportunity for both academia and industry.
This workshop intends to gather experts in the field to establish an overview of the current state of short-reach optical communications with a focus on:
• Emerging applications, requirements and constraints for short-reach communications
• Technologies choices: Coherent-, direct- and self-coherent detection
• Photonic integration for short-reach communications
• Advance photonic and digital signal processing for short-reach communications
• Seamless network convergence between PONs, RANs and Li-Fi. The workshop further aims at stipulating an open discussion between panelists and attendees on the challenges and opportunities envisaged in short-reach systems.



William Shieh, Westlake University

Jiangming Tang, Bangor University

Qi Yang, Huazhong University of Science and Technology



Dezhi (James) Zhang, TBD, Development and evolution of optical access standards and technologies

Shuangyi Yan, Bristol University, Network convergence

CHI Nan, Fudan University, Li-Fi Vision

Wei Chen, Fudan University, Body-area network
Chongjin Xie or his colleague, Alibaba, Datacenter Networks
Christian Bluemm, Huawei Technologies Co.,Ltd, Neural Network Equalizers for Short-Reach Optical Communication

Wei Jin, Bangor University, Point-to-multipoint Flexible Transceivers for Inherently Hub-and-Spoke IMDD Short-reach Optical Networks: Techniques
and Applications

Meng Xiang, Guangdong University of Technology, Carrier-free Phase-retrieval Receiver with Adaptive Intensity Transformation

Dekun Liu, Huawei Technologies Co.,Ltd, 50G PON helps usher in the 10G Era and embrace smart Connections for Everything

Gangxiang Shen, Suzhou University, Unified PON and Wi-Fi Access


    Workshop: Role of optical technologies in the future datacenter networks (DCNs)

The traditional datacenter networks (DCNs) based on all-electronic fat-tree architecture suffer from the issues of low capacity and scalability, long latency, and high power consumption. On the other hand, because all-optical technologies including optical transmission and switching have the advantages of high capacity, low power consumption, and better scalability, optical technologies are becoming more and more penetrating DCNs. Various electronic-optical hybrid architectures and even all-optical architectures have been proposed and studied. Testbeds and prototypes of these types of architectures have also been demonstrated by several important cloud service providers. A consensus seems to have been reached that optical technologies must and will be there in the future DCNs.

This workshop aims at providing a platform for speakers and audience to discuss the challenges and solutions of optical technologies for DCNs. The topics will focus on several aspects: first, we will debate the necessity of optical technologies for DCNs; second, we will overview recent progress in short-reach optical transmission technology for DCNs; third, we will discuss all-optical switching technology and architectures for DCNs; fourth, we will discuss the control, management, and operation of optical-technology-enabled DCNs.
This workshop is expected to attract a strong industrial and academia audience as, in the current cloud-computing era, optical technologies for DCNs is becoming more interesting to service providers and network equipment vendors and what role the optical technologies will play in DCNs is still under extensive debate.
This workshop will specifically discuss the following aspects:
1) Is it necessary to bring optical technologies, especially optical switching, in DCNs?
2) What role will optical technologies play in DCNs?
3) When will optical technologies dominate DCNs?
4) Which will be the main form in the future DCNs, electronic-optical hybrid or all-optical? For the hybrid type, what are the best percentages for electronic and optical technologies?
5) Is it possible to have an architecture that can efficiently support both general data center traffic and special AI traffic?
6) Which switching type should be adopted for DCNs, packet switching or circuit switching? Which optical switching technologies will be employed for the future DCNs, and if so, which all-optical switching architecture will be, Torus or Clos?
7) What values do DCN stakeholders expect milliseconds level optical switching to bring?
8) Should we disaggregate the future DCNs, and if so, fully or partially?
9) How to reduce service latency and power consumption of optical technology-enabled DCNs?
10)How to improve scalability and reliability of optical technology-enabled DCNs?



Gangxiang Shen, Soochow University

Ning Deng, Huawei Technologies Co.,Ltd



Junjie Li, China Telecom, The Prospect of Several Optical Technologies in Future DC

Dechao Zhang, China Mobile, All Optical Transport Network for Computing Force Network

Shengyu Shen,  Huawei Technologies Co.,Ltd, 2-Core fiber for practical spatial division multiplexing

Chongjin Xie,  Alibaba, Optical Technologies for High-Performance Computing Networks

Xu Zhou,  Baidu, Optical Interconnection Technology in DCN in the AIGC Era

Liangjia Zong,  Huawei Technologies Co.,Ltd, All Optical Switching Technologies in DCNs

Yongli Zhao,  BUPT, Data Center Optical Networks with Communications, Computing, Caching, and Cipher (4C) Resource Coordination

Chao Lv,  Sun Yat-sen University, Transmission Techniques for Future Data Center Networks


    Workshop: Multicore Fibers and Applications

Discuss and debate the latest advances on multicore fiber design, fabrication and applications of telecommunications and sensing. We aim to have an enhanced interactivities connecting with academia and industry, inspiring both the speakers and the audience, and brainstorming the possible roadmap for future technology development of multicore fibers.



Li-Min Xiao, Fudan University

Xiaojun Tang, Huawei Technologies Co.,Ltd



Tristan Kremp, OFS Laboratories, Low Loss Multicore Fiber Fusion Splicing

Wei Chen, Shanghai University & Hengtong Optic-Electric Co., Ltd., Research on low-loss seven-core fiber and its characteristics

Takemi Hasegawa,  Sumitomo Electric Industries, 2-Core fiber for practical spatial division multiplexing

Jun He,  Shenzhen University, Multicore Fiber Bragg Gratings Array for 3D Vector Sensing Applications

Yichun Shen,  Zhongtian Technology Co., Ltd., Research on multi-core fibers used for next-generation large-capacity short-reach optical interconnects and long-haul optical transmissions



  Workshop: How open and disaggregation will optical networks go?



Chongjin Xie, Alibaba Cloud

Jim Zou, ADVA



Liang Dou, Alibaba Cloud, Possible directions for the open and disaggregation optical networks

Minggang Chen, Tencent, Development of Tencent Open Optical Networks

Qin Hu, China Telecom, Adopting open and disaggregation optical network in metro area of AON 2.0

Shiqui Shen, China Unicom, Advantages and lessons of open optical network deployment in China Unicom

Sone Yoshiaki, NTT, Open Optical Transport Systems: Ensuring the Disaggregation ecosystem and the Interoperability for B400G

Michael Eiselt, ADVA, Real-life aspects of disaggregated optical transport

Xiaohong Zhang, Nokia Shanghai Bell, the automation for open optical network

Yingkan Chen, Coherent, Applications in Open and Disaggregate Network from Component Supplier Perspective

Filippo Cugini, CNIT, Operations and control of IPoWDM white box


    Workshop: Integrated photonics and applications



Xingchen Ji, Shanghai Jiao Tong University

Yang Li, Huawei Technologies Co., Ltd



Xianfeng Chen, Shanghai Jiao Tong University,Integrated Photonics Technology on Thin-film Lithium Niobate

Baoping Zhang, Xiamen University,III-nitrides Material and Device

Ting Hu,  Shanghai University,Integrated Opto-Electronics device and Metasurface Device

Yixiao Zhu, Shanghai Jiao Tong University,Digital-Analog Hybrid Fronthaul Technology

Hui Yu,  Zhejiang Lab,Integrated Opto-Electronics Technology for ROF

Pengfei Tian, Fudan University,GaN based Micro-LED Technology

Ping Ma, University of Science and Technology of China,Novel High-bandwidth Micro/nano Photonic Devices

Zhigang Zheng, East China University of Science and Technology,Liquid Crystal Material, Devices and Their Applications

Yan Cai, Shanghai Institute of Microsystem and Information Technology,Silicon photonics integrated technology

Jianan Duan, Harbin Institute of Technology Shenzhen,Quantum Dot Laser Technology and Applications

    Special Events: Green Data Com: Intelligent Physics Can Contribute to a Sustainable Society

The main theme is bringing together developers of novel energy-efficient  devices and modules with active cable manufacturers and system  operators, in order to develop strategies to reduce power and water consumption of data centers.



Dieter Bimberg, CIOMP of Chin. Academy of Sciences and Technical University of Berlin

Connie Chang-Hasnain, Berxel



Fumio Koyama, Tokyo Institute of Technology,VCSEL Photonics for High-speed Interconnects and 3D Sensing

Jiaxing Wang, Berxel Photonics,106Gbps per lane PAM4 VCSEL for Datacenter and Supercomputing

Sicong Tian,  CIOMP of CAS,Energy-Efficient High-Speed Vertical-Cavity Surface-Emitting Lasers for Data Communication

Mike Wang,  Everbright Photonics Ltd,High Power Multi-junction VCSEL Array

Leonid Karachinsky,  Connector Optics LLC and ITMO University, St. Petersburg,Long-wavelength VCSELs fabricated by MBE and wafer fusion

Elad Mentovich, Nvidia Yokne'am Illit,TBD